The Biden administration announced a significant investment of $825 million on Thursday to establish a state-of-the-art semiconductor research and development facility in Albany, New York. This initiative is part of a strategic effort to enhance high-tech manufacturing in the United States and to decrease dependence on foreign technologies.
The new facility is poised to drive innovation in extreme ultraviolet (EUV) lithography, a sophisticated technology critical for semiconductor production, according to statements from the U.S. Department of Commerce and Natcast, which operates the National Semiconductor Technology Center (NSTC). Commerce Secretary Gina Raimondo remarked that this investment is a pivotal step in ensuring that the U.S. remains at the forefront of semiconductor innovation and development.
Last year, Secretary Raimondo indicated her plans to initiate multiple funding awards aimed at reshaping the landscape of U.S. chip production. This announcement follows the recent news that the administration is finalizing new regulations to limit U.S. investments in artificial intelligence and other technological sectors in China, actions taken to mitigate potential risks to U.S. national security. These restrictions are slated to take effect on January 2, forming part of a broader initiative to prevent U.S. expertise from aiding Chinese advancements in sophisticated technologies.