LPCAMM2 is the latest stride in memory technology, presenting a compression-attached memory module designed to usher in power efficiency advancements and modernize memory configurations in the upcoming generation of laptops. Recently standardized by JEDEC, LPCAMM2 packages dual-channel LPDDR5/X and DDR5 memory onto a slender, replaceable circuit board. Micron Technology, a major player in memory chip manufacturing, has announced its readiness to supply LPCAMM2 modules, available in capacities of 16GB, 32GB, and 64GB, as showcased at CES 2024.
The impact of LPCAMM2 is expected to be more pronounced in laptops accustomed to DDR5 memory, as opposed to those employing LPDDR5/X. This distinction arises from LPCAMM2’s utilization of LPDDR5/X, albeit in a distinct physical configuration. Notably smaller than the DDR5 SODIMMs prevalent in high-performance laptops, LPDDR5/X brings enhanced power efficiency and potential speed, boasting a maximum supported data rate of 9,600Mbps, with the “LP” in “LPDDR” signifying its low-power attributes.
A transformative feature of LPCAMM2 is its upgradability, addressing a significant limitation in current LPDDR5/X designs, which are typically soldered to motherboards, hindering flexibility and upgrade options. While the modules require tools for removal, the presence of three accessible screws facilitates secure attachment to the connector. Furthermore, the standardized design holds the promise of diverse module options from various manufacturers, enhancing user flexibility in upgrading.
While Micron leads the charge by announcing the availability of LPCAMM2 modules, other industry players are likely to follow suit. Samsung’s unveiling of LPCAMM memory in September 2023, serving as the developmental precursor to LPCAMM2, anticipates further advancements in memory technology, fostering a landscape of innovation and user-friendly upgrades.